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The Study Of High-throughput Data Interface Technology In Data Center

Posted on:2011-05-22Degree:MasterType:Thesis
Country:ChinaCandidate:W LiuFull Text:PDF
GTID:2178360308964338Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
With the development of microelectronic technology, high-speed and high-density interconnect are the today's electronic products development trends. As the clock frequency of the continuous improvement, the signal's rise and fall time shorten and the increasing in interconnection density, signal integrity issues become more and more prominent in high-speed circuit design. The challenge of high-speed circuit design is more and more serious because of signal integrity problem, such as reflection, crosstalk, propagation delay, ground/power layer noise and so on. If don't regard to its effects in high-speed circuit design, the circuit with correct logic function often does not work while debugging. How to solve the signal integrity issues has become a very important element in high-speed system design.It is efficiency and high quality to complete system design only using new design method, new technologies and new analytical tools to identify problems at the design stage.Firstly, signal integrity theories for high-speed circuit design are analyzed in detail and practical simulated. Generation mechanism for reflection, crosstalk and switching noise is analyzed based on in the detailed description of the transmission line theory. Then this article studys the impact factors which effect reflection, crosstalk, and simultaneous switching noise, and summarizes some of restraining measures.Secondly, Based on FDTD method described in detail, this article studies an simulation analysis method base on FDTD method combined with the SPICE.then, based on finite difference time domain method,this paper analyzes coupled transmission lines'crosstalk from the perspective of frequency domain,and established S-parameter models for coupled transmission line on four layers PCB board with via holes.Thirdly, this paper studies the IBIS model using in signal integrity analysis. As IBIS model always overestimated simultaneous switching noise, IBIS model is improved in order to be able to improve accuracy for simultaneous switching noise analysis. Finally, based on FDTD method and IBIS model, this article analyses signal integrity issue of FPGA's DDRII SDRAM interface circuit, and propose solutions, which is very important to PCB board design.
Keywords/Search Tags:High-speed circuit, signal integrity analysis, The finite-difference time-domain method, IBIS model
PDF Full Text Request
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