| The rapid development of Modern microelectronic technology in wafer fabricationbrings intensive integration for ICs. Taking the processor for example, there have beenbillions of transistors integrated in a single die and the working frequency has passed3GHz, the power is higher than 100 W. So, the heat-sinks are able to produce significantEMI while they are cooling the processors. The primary source of these energy is thesilicon die, which is strongly coupled to the heat-sink and will results in deterioration ofthe electromagnetic environment. As a result, we need to understand the cause ofradiated emissions from heat-sinks and find methods to reduce them.In this paper, taking the Intel Pentium4 CPU heat-sink for example, thecharacteristics of electromagnetism and heat dissipation are studied in detail. Firstly, theinfluences of heat-sink size and geometry on electromagnetic characteristics areanalyzed. The heat-sink's radiation has evident directions. Compared to other factors,the excitation sources locations, the ground size and the heat-sink geometry play thegreater role in the electromagnetic characteristics. Secondly, the influences of heat-sinkgeometry on heat evolution are analyzed. Both the heights and the structures of the finsare the main factors which influence the heat dissipation.Based on the comprehensive analysis of the heat-sink, Some advises of heat-sinkselection are presented and some optimal design methods are provided. |
PDF Full Text Request