Research Of The Ultraprecision Machining Techniques Of Monocrystalline Silicon Wafer

Integrated circuit (IC) is the basic of modern information industry and information society. The technique of IC is the high and new technology of promoting the national economy and the development of information society. It is also the core technology of converting and promoting the traditional industry. The material of IC is mainly of silicon wafer, germanium, the mixed of arsenic and gallium and so on. Silicon wafer used in IC of the world is over 90 percent.The high quality silicon wafer is the basic of chip manufacturing and IC development. The silicon wafer of integrated circuit manufacturing is not only required sky-high degree of plane, minimum surface roughness but also required no deteriorated stratum and no nick on the surface. The techniques and the equipment of lapping and polishing of silicon wafer react weightily in the IC manufacturing and it is the key technology of IC manufacturing.This paper mainly studied the basic of techniques of lapping and polishing of monocrystalline silicon wafer. Silicon wafer crystal is attributed the material of hard, fragile and difficult to machining. The...