| With the rapid development of electronic products miniaturization and the driven of liquid crystal display electronic products , a new generation of packaging technology COF (Chip On Flex or Chip On Film) development also booming, and it has become one of the main package of flat panel display driver IC such as LCD (Liquid Crystal Display), PDP (Plasma Display Panel), COF flexible printed circuit board, as an important component of the COF, is currently in a trend of rapid growth in technology and market.but At present, COF product is still in the initial stage of exploration at domestic, COF substrate production can only meet 50/50μm small batch production. Inkjet printer cartridges COF flexible PCB has been monopolized by Japan and other countries, and there has not yet have production company at domestic, so cartridges flexible PCB production in China is still blank.Material aspects: the stability of materials directly affect the accuracy of COF package,In this paper ,we calculated the stability of COF materials by the error of before and after substrate vacuum treatment.Photoresist: Photoresist resolution decisides the limits the production of fine lines, and is particularly important in fine lines production .In this study ,we used dedicated film-resolution test to test the dry film and liquid photoresist distinguish rate ,through different photoresist performance testing, and do further research on the dry and wet adhesion membrane.For production of fine lines:We do research on the fine line of the COF through the chip, RTR production methods and liquid resist and optimized the main parameters by orthogonal processes ,and obtained the optimization parameters which meet small batch production. By parameter optimization of Chip 25/25μm fine line production ,we determined the 8μm, 12μm copper foil as the substrate, film pressure 85Kg/cm2, transmission speed 0.76m/min, temperature 100℃, light intensity was 4.0 level, imaging speed 1.2m/min, etch speed of 2.0 m / min, and as a resule we produced line 25/25μm fine successfully . Through orthogonal analysis experiment for parameters of RTR ,we abtained the expose level 5.0, imaging speed 2.5/min, etching speed 4.0m/min, etching pressure 1.5m/min and produced the fine line 25/25μm Ultimately. This is the first test to use new type of COF special liquid photo as resist to produce 40/40μm, and optimizated parameter to abtained curing time for 10min, exposure level4.0, imaging speed 4.0m/min, etching pressure 1.0m/min ,and eventually obtained the fine line of 40/40μm.COF substrate inkjet cartridges is based on the production of fine lines and flying lead at window .For flying lead inkjet printer cartridges COF substrate production, We have done a lot of pre-research work with COF flexible printed circuit board key technologies for the ink-jet printer cartridges, and through the four methods of lamination method, plasma method, laser method and chemical etching,we successfully tried out the vacant COF substrate with width / space 50μm/100μm. Laminated optimize the parameters of copper foil and PI binding capacity to obtaine ink-jet printer cartridges to meet the requirement of the bonding wire suspended parameters; method of plasma optimized etching plasma PI window parameters, and abtained optimized PI etching parameters; chemical etching method produced new way to lead in vacant by changing the configuration of new etching fluid and the process; laser method is a new technology try to vacant lead in this paper, as the laser method has shortened the process of manufacturing processes significantly, There is so great space for development in the future. In this paper, we use the above-mentioned four methods to produce inkjet printer cartridges, experiment proves that it is entirely feasible of inkjet printer cartridges COF flexible printed circuit board production, and it has a bright prospect for development. |
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