Research On Low Strain Reflected Wave Acquisition System With SOPC

With the development of the embedded system technology, the innovational ideals of design and advanced implements appear very rapidly now. The traditional engineering testing instruments are designed by separate components and circuits, and therefore, have the disadvantages of big circuit board, high power consumption, and weak anti-noise ability. The System-on-Programmable-Chip(SOPC) technology integrates CPU, memory, I/O interface and digital logic resources on a single FPGA with some other reconfigured functional modules that are required in system design. Consequently, comparing with the traditional design pattern, it's a great breakthrough to apply this advanced technology to the design of engineering testing instruments. It also helps to reduce the quantity of components in circuit board, cut power consumption, expand more functions, save development cost, and shorten the R&D cycle.This paper is aimed at researching the design of SOPC-based low strain reflected wave acquisition system, which combines the low strain piles integrated testing instruments widely used in civil engineering. This design adopts Altera 32-bit Nios II soft-core processor and Cyclone II FPGA on-chip resources, develops the embedded system platform, takes HW-SW co-design method, and realizes the quickly system building.According to the requirement of the system structure and function of low strain piles integrated testing, this system is implemented by SOPC module, signal acquisition module, power supply and communication interfaces. The system designing and debugging are finished well. It is realized to satisfy the real time and stability of system thatμC/OS-Ⅱoperating system is transplanted into this SOPC platform successfully.This system has the advantages of excellent stability, low cost and low power consumption, and can be widely used in the integrity testing of foundation piles. What's more, thanks to the flexible SOPC technology, this system has a potential ability of quickly reconfiguring, satisfying the requirement of other engineering testing, offering the intelligent instrument design's modularization and virtualization of a development platform. The production of this paper has an instructional value to the design of novel engineering testing instrument.