Research On Cooling Of High Power LED Light Source

White-Light-LED bears many merits, such as low load voltage, small power consumption, high luminous efficiency, pure photochromic solid structure, shock resistance, stable and reliable performance, light weight, small volume, low cost, and without mercury, therefore it has been developed by leaps and bounds and is bound to become the major light source of general lighting market in the future. Furthermore, the competition of the whole LED market will be changed dramatically. With the merits of small power consumption, environmental protection, and long life, White-Light-LED can be applied in various industries, such as communication, electronics, automobile, and PV display, and it can also compete with the traditional illuminating devices, and it can therefore become the dazzling star in the future lighting market. The specific contents and innovations are as follows:Firstly, the luminous principles of LED devices and electrode structure of the chip were presented; the evolution of chip packaging structure and the luminous principle of White-Light-LED were introduced; and the current international mainstream of white packaging technology was also introduced combined with the evolution of LED chip packaging structure.Secondly, according to the different forms of LED chip packaging and the different forms of LED chip, analysis of their different resistance network was introduced in details. Then for different forms of packaging, some corresponding heat release methods and their features suitable to LED were introduced.Thirdly, a closed microjet cooling system for 2×2 LED array was designed, a series of experimental study for heat dissipation measurements of differ electric power have been conducted. Then thermal modeling and parameters analysis of 2×2 LED array package integrated with an innovative microjet cooling module was fully investigated. Finally, multiple chips white light LED packaging technology is designed after researching LED packaging structures, white light LED and chip on board packaging technology. A closed microjet cooling system for 8×8 LED array was designed, then a series of experimental study of the cooling system and thermal modeling and parameters analysis of the closed microjet cooling module were thoroughly investigated.The purpose of this thesis is to provide some theoretical and device basis for the heat dissipation and package of high-brightness lighting LED heat release to save energy, protect environment, reduce costs, improve the life of lamps, and therefore promote its development and application.