Research On Packaging And Cooling Of High-Brightness LEDs

White-Light-LED bears many merits, such as low load voltage, small power consumption, high luminous efficiency, pure photochromic solid structure, shock resistance, stable and reliable performance, light weight, small volume, low cost, and without mercury, therefore it has been developing by leaps and bounds and is bound to become the major light source of general lighting market in the future. Furthermore, the competition of the whole LED market will be changed dramatically. With the merits of small power consumption, environmental protection, and long life, White-Light-LED can be applied in various industries, such as communication, electronics, automobile, and PV display, and it can also compete with the traditional illuminating devices, and it can therefore become the dazzling star in the future lighting market. The specific contents and innovations are as follows:Firstly, the luminous principles of LED devices and electrode structure of the chip were presented; the evolution of chip packaging structure and the luminous principle of White-Light-LED were introduced; and the current international mainstream of white packaging technology was also introduced combined with the evolution of LED chip packaging structure.Secondly, according to the large heat flux of LED, some heat release methods and their features suitable to LED were introduced in details. Heat sink and fans are simply designed and their process are mature, but bear bad cooling ability; heat pipes have low costs, but bear small cooling temperature range; thermoelectric refrigeration has small volume, light weight, non-mechanical movement, rapid refrigeration, non-pollution, and non-noise, but bears low heat dissipation efficiency and low welding strength.Thirdly, the principles and merits of microjet water-cooling devices were introduced; the structure of microjet was designed according to its dissipation characteristics; the reduction of friction and adhesion was studied; heat modeling was conducted; and closed microjet efflux cooling system cooling capacity of 70-500W/cm2 was designed.Finally, a series of heat dissipation measurements have been conducted by the application of heat sink fans, heat pipes, and closed cooling system and the comparison of these different heat dissipation ways. Experimental results demonstrated that the efficiency of closed microjet efflux cooling system was the best. Under low power conditions, its temperature lower than heat dissipation of heat pipes by 3℃and lower than heat sink fans by 6-9℃. Under high power conditions, its performance will be much better.The purpose of this thesis is to provide some theoretical and device basis for the heat dissipation and package of high-brightness lighting LED heat release to save energy, protect environment, reduce costs, improve the life of lamps, and therefore promote its development and application.