Study On Fabrication Of Conductor By Microjet And Laser Hybrid Direct Writing Method

With the development of electronic & electrical areas, there are more rigid requirements in thick film manufacture. By traditional methods, the limitation of the precision of circuit, the flexibility and the cost had become main bottleneck. In order to solve above problems, new circuit fabrication technology was presented——Microjet and Microjet/laser hybrid direct writing technology. Under the fund of National Natural Science Foundation and the Project of National'863'Hi-Tech Research and Development Program, the technology was studied systematically, and the main results as followed: The parameters on conductor line width were studied in detail. The results showed that: the atomizing air pressure has important affects on the coating line width. If the atomizing air pressure was too low, the atomized mists would be deficient and lead to form the discontinuous coating. On the contrary, if the atomizing air pressure was too high, the excess gas would blow the formed coating and there would make the line wider and thinner. The minimum width of the coating would be obtained if substrate was put on the focus of nozzle. Otherwise, if substrate was out-of-focus, the coating line width would be increased. Laser treatment can solidify the coating on the substrate and decrease the line width. At the same time, the laser spot quality and the substrate properties can also determine the coating line width. The ultimate heat treatment after laser processing would be benefit for the electric performance of conductor and adhesion between conductor and substrate.Finally, the performance of conductor fabricated by this novel technology was studied. The minimum width of conductor fabricated by this technology was about 40μm, and the resistivity of conductor was at the same magnitude of Ag which is about 1.6×10^-6Ω·cm, what is more, the adhesion between conductor and substrate was at the magnitude of MPa which could meet the requirement of application.It is a novel circuit fabrication technology and it could rapidly fabricate high precision circuit on different substrates material. It can be predicted that Microjet and Microjet/Laser hybrid direct writing technology must play an important role in the circuit fabrication areas in future.