The Research Of Parylene Application Technology In Hybrid Integrated Circuit

The project is a technology innovation of Technological Research Institute of Xi'anMicroelectronics, and is supported by Aviation Scientific Reseach Fund. Aiming at the urgentproblem of protection againist humidity in hybrid intergrated circuit, a new applicationscheme adopting new material-parylene is proposed in this paper, and used in hybridintergrated circuit.First of all, the extensive applications requirement on various fields of hybrid intergratedcircuit are introduced, and the reliability of thin-film and thick-film hybrid intergratedcircuit is described. A mothed of protection againist humidity smearing material-parylene isproposed for the airproof reliability of circuit sealing. The attribute, application andtechnology characteristic ofparylene are discussed in the paper. The application objective andtechnology compatibility are deep discussed, and matching application of expandingcoefficient of parylene and bonding thread is explained and verified. At the same time,different protections of smearing are elaborated in details. Smearing experimentations ofsome different kinds of circuits are carried out, and a series of reliability experimentationsare prosecuted according to GJB. Finally, the result is analyzed and summarized.The result shows the application of parylene can solve protection againist humidity ofthe technology of hybrid integrated circuit.