Investigation On Thermal Design Of High Power Electronic Components And Equipment Structure

With the rapid development of electronic technology, it becomes more and moreimportant for thermo dispersion of the high power electronic devices. As a typical powerelectronic module, IGBT has the same thermo design request as other high powerelectronic devices. Based on consulting a number of references and relative standard andtest requires, the flowing field and temperature field simulation were carried out byusing the software ANSYS, based on the uncompressed-viscosity control equation andstandard K-εmodel, and the effect of different parameters on heat sink, which is the keycomponent for IGBT used in DSTATCOM, was profoundly studied,which providedtheoretic base for optimal design and had the characteristics of convenience and visual.Research results indicated that water-cooling heat sink can meet the thermodispersion request which is an effective method to solve the cooling of the powerelectronic module. Meanwhile, simulation technology can not only predict test, but evenreplace some and achieve dynamic optimal design of products.