Experiment Research Of Integrated Constant Temperature Heat Sink Based On Thermoelectric Cooler(TEC)

With the high-speed development of modern science and technology, electronictechnology takes an important place in this field.Rising performance requirements ofelectronic devices or electronic devices are higher and higher,especially are morestringent for the temperature changing requirements.On many occasions,it isdemanded to know the system of temperature characteristics,heating power and soon.In recent years, many scholars have conducted an in-depth study of constanttemperature control for electronic devices,temperature controller and temperaturecontrol which are made use of thermoelectric cooler(TEC) are better prospect fordevelopment.Because the TEC has unique thermal features,such as no pollution, norefrigeration,size smaller, and so on.Moreover its is a current driving device,so it iseasy to form a feedback system.And application for TEC systems is research hotspotin recent years.Currently there are lots of constant temperature controller for TEC on themarket,but TEC and heating system are the weak links.The heat sink designed in thispaper is thermostat thermal device upon TEC,because TEC is a current drivedevice,which is easy to control by current.When TEC is with thermostat controlmodule together,we can get different results from the usual function of the coolingsystem.Main of innovation points has two points:one hand is that thermal system isactive thermal system,which called adaptive TEC thermostat radiator can be setaccording to the different needs of the steady-state temperature value.The other handis that the heat sink is active heat sink,so it requires a current drive to work.Thepurpose of the last is to design a TEC heat sink,it with the constant temperaturecontrol to get the temperature control for heating device.In this paper semiconductor temperature controller is adopted the WK-2500T of our group, powertransistor(2SC3280) in power amplifier is in different power by changing the heatresistance of the potentiometer in the circuit,which is cooled by system built forrefrigeration.This article’s main work is divided into the following four parts:(1) Discussed the work principles and application methods of TEC,andintroduced its various work.While described the idea of setting up thermal resistanceon heating system in detail,according to different TEC structure, equivalent thermalcircuit model of the TEC;(2) Setting up the heat sink and fan system based on TEC,this article describedfour methods of TEC hot-side heat dissipation,and analysed the theory of heat sinkand thermal resistance models.The way of heat sink used forced-air cooling,whichwas studied on model of force-air cooling;(3) Carried through the simulation experiments of TEC cool side and the heatingdevice,creating a simulation model using Simulink of Matlab software in this article,analyzed of the simulation results, and concluded the theoretical results;(4) According to the theory of analysis,accomplished the experimental analysisof semiconductor constant temperature,identified experiment programme,to determinethe components of the model,performance testing for building integrationmodel,which controlled of the different heating power using the samesystem,recorded the refrigeration process system,finally it is concluded that theexperimental results and analysis of experimental results.Based on the principle of TEC,optimized to TEC use,research has shown thatwhen using forced air cooling,The influence is better than any way with which air fansupplied mode is on top of the fan heat sink.When the base plate area of heat sink isthe same,there is an an optimal value about the thickness of fin.Through the simulation experiment,we can conclude the relations between the heating device andTEC cold side.TEC’s input power is not more, there is better the influence of heatingdevices, so we should choose the appropriate input power,not blindly believe thatbigger is better.Processed the experimental data of the build system,we can find thatthe different heating power is varying temperature control for the same coolingsystem.Finally less power devices for devices or equipment could achievetemperature lower than others,and reach steady state time which was faster,accordingto the theory and experiment,we can obtain the TEC optimal design of coolingsystem.