Design And Performance Research Of Integrated Liquid Cooling Heat Sink With Vapor Chamber For High-power IGBT

In recent years,with the rapid development of electronic components,the heat flux of electronic components keeps increasing,and high-power IGBT is facing the cooling problem caused by the increasing power loss.Aiming at the problem of the mean temperature performance of direct liquid cooling heat sink is poor,and thermal resistance of indirect liquid cooling heat sink is large;this paper puts forward weld IGBT substrate in the vapor chamber with microchannel heat sink at back encapsulated into integrated liquid cooled heat sink with vapor chamber(integrated heat sink).In this paper,the following research work has been done on the integrated heat sink for high-power IGBT heat transfer:(1)The structural design of the integrated heat sink was carried out,finite element software ANSYS was used to analyze the static stress of the vapor chamber,and the influence law of the shape and size of the support column on the stress and strain of the vapor chamber in the integrated heat sink under different working medium steam temperature was studied.Finally,the supporting column of the vapor chamber in the integrated heat sink was determined to be a circular pillar with a diameter of 3mm.(2)A performance test platform of the vapor chamber and heat sink was built,and the performance evaluation index of the vapor and heat sink was put forward.The experimental results show that the thermal resistance of the vapor chamber decreases with the increase of the heating power,the average temperature and maximum temperature difference of the heat source increase with the increase of the heating power.In order to improve the performance of the integrated heat sink,the evaporation end of the vapor chamber adopts the copper powder sintered liquid absorption core,and the condensation end adopts the copper foam liquid absorption core,and the liquid injection rate is 100%.(3)The heat transfer performance of the integrated radiator was studied by experiment,the performance difference between integrated heat sink ? separated heat sink and the independent microchannel heat sink were compared,the experimental results show that the integrated heat sink can reduce the thermal resistance when compared with separated heat sink,it also greatly improve the mean temperature performance of the heat sink when compared independent microchannel heat sink.The key factors affecting the performance of integrated heat sink were further studied,the results show that the microchannel array core has the best comprehensive performance among the three types of heat sink cores,and the microchannel array is selected as core of the integrated heat sink.The temperature of the heat source increases with the increase of the cooling water temperature,but the average temperature performance is better,it's preferable to choose higher cooling water temperature on the premise of satisfying the heat dissipation requirements.Among the four installation angles,the integral radiator has the best heat dissipation performance and average temperature performance when the installation Angle is 60°,so the installation Angle is recommended to be 60°.