The Application Of Failure Analysis For DRAM Product

Failure Analysis is to study the failure device, find the failure mechanism, put forward the improvement method, in order to enhance the yield and reliability of the product. Failure analysis is one mandatory point within the whole process from product design, development, through manufacturing, till reliability test and quality result feedback. Till now, during the development of IC industry, failure analysis already became one of the mandatory investigation method for any advanced Semiconductor foundry. Especially as process was developed towards the direction of deep sub micron, the deposited film is thinner and thinner, the fatal size of the defect is smaller and smaller and then the need for failure analysis is also continuously increased.In the past years, some new analytic technology and method were introduced throughout the world, such as optical microscope, SEM, FIB, TEM, EDS, etc. The architecture, operation theory and application are discussed in detail in this paper, high resolution and high precision are the advantages of these tools and it causes these tools becomes more and more important and broadly used in the process monitor, failure analysis in the IC industry. These technology and methods significantly drive the development of the failure analysis technology for electrical components and propel the development of failure mechanism study.This paper discusses the application of failure analysis for DRAM product and how to improve product yield through failure analysis in detail. This paper also introduces many real cases to present the steps and method of failure analysis and then discloses the very important role of failure analysis for yield improvement of IC product. Failure analysis target to find the failure root cause, identify the improvement actions and finally enhance the product quality, so it's very important and can't be replaced for the whole Semiconductor process.