Research On Low Power Design Method Considering Temperature In 3D-Ics

The increasing market of mobile product has urgent requirement in low power. The proposing energy saving and environmentally friendly national policy and low carbon concept deeply rooting among peoples, the VLSI low power design is becoming increasingly important. Minimization of power consumption is the key technique in modern VLSI design. In order to further reduce the interconnect delay and improve the performance, in the design and manufacturing process chip, " Three-dimensional Integrated Circuits(3D ICs) " appeared.3D ICs can significantly improve the performance of the chip,and it's biggest problem is heat dissipation problem.A low power technology suitable for 3D ICs was proposed in this thesis based on the study of VLSI design process and various stages of the low power technology.First, this thesis analyzes the power source, and introduces low power technology in different levels of VLSI design, then compares different low power technical effect.Secondly, this thesis introduces the Synopsys Liberty libraries and how to extract power consumption data from Liberty.And then introduces the three-dimensional chip thermal resistance model, and uses this model to calculate the temperature of the three-dimensional chip modules. Experimental results show that, with the increase of 3D ICs layers, temperature of 3D ICs soared and can increase to several thousand degrees Celsius that far beyond the temperature that chips can withstand.Finally, the thesis proposes a voltage island low power consumption technology suite to 3D ICs. We use the ILP algorithm to generate voltage islands, and consider the chip temperature while generating voltage islands.Experimental results show that our algorithm can obviously reduce the temperature of the 3D ICs.