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Keyword [Three-dimensional Integrated Circuits (3D ICs)]
Result: 1 - 14 | Page: 1 of 1
1.
Study On Electromagnetic Characteristics Of Novel Through-Silicon Vias
2.
Research On Low Power Design Method Considering Temperature In 3D-Ics
3.
Analysis Of Key Characteristics Of Through-Silicon-Via(TSV)-Based Three-Dimensional Integrited Circuits (3D ICs)
4.
Electrical Characteristics Study Of Tapered TSV Interconnectors On High Density3D-ICs
5.
The Research On Fault Tolerance Of TSV For Three Dimension Integrated Circuit
6.
Key Design Technologys Of High Speed Three-Dimensional Integrited Circuits Based On Through-Silicon-Vias
7.
Research On Techniques Of Vield And Testing Costs For Three Dimensional Chips
8.
Multi-field Analysis Of Through-Silicon Via (TSV) Links In 3D ICs
9.
Design And Analysis Of TSV-Based 3-D ICs And Passive Devices
10.
Modeling,Design And Optimization Of Differential Transmission Structure In 3-D ICs
11.
Analytical and experimental investigation of thermal transport in three-dimensional integrated circuits (3D ICs)
12.
Three-dimensional Integration Thermal Management And Chip-level Thermal Stress Modeling And Simulation
13.
Signal Integrity Analysis Of Through-Silicon Vias (TSV) Filled With Carbon Nanotubes For 3-D ICs
14.
Research And Implementation Of Key Techniques In 3D Clock Tree Synthesis For Noise Avoidance
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