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The Study To The Key Problems Of Fabrication Process Of Filed Emission Display Devices

Posted on:2005-07-05Degree:MasterType:Thesis
Country:ChinaCandidate:C P ZhangFull Text:PDF
GTID:2168360125450882Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
Field emission display (FED) as a member of flat panel display has been developed recently, since it shows the promising capabilities such as the picture quality as CRT, the appreciated thickness as LCD and the large screen as PDP. FED has advantages on luminescence efficiency, brightness, view angle and power cost. This thesis has firstly reviewed the development background of FED, and discussed the general device structures based on cold-cathead materials. The diamond films are prepared on silicon pin arrays, the field emission mechanisms and properties are discussed, and finally the device assembly processes are performed.Chapter 1 has reviewed the development of FED technology. Chapter 2 has discussed the physical model of field emission. Chapter 3 has prepared the anode with electrophoresis, and the influence of solution concentration and fluorence powder contents on the deposition process has been studied. Chapter 4 has investigated the fabrication process of FED devices, employing the transfer-printing of electrode, and the lead-out of electrodes and vacuum keeping are discussed.Main researches of this study are as follows:It can solve the problem of lead-in wire to apply electrode transfer method in the lead-in wire packaging of field emission devices. Adopting metal pressure welding at fixed thickness can ensure the good contact state for electrodes and insulation between cathode and anode. Besides, this process can avoid failures caused by welding and cementation, i.e., direct short caused by unevenly welding; aging caused by gelatins, etc. In addition, this process can realize the simplification in FED packaging and make the lead-in wires to be available and pleasing to see. Problems exist in FED device preparation. First, it is necessary to seek for the insulation materials with stable structure and thickness of only scores ofμm. Second is how to realize and retain the high vacuum in the space of only a small number of μm. Last but not the least, how to keep the display panel not to deform in the occasion of pressure differences between the inside and outside of the device.Degasser selection depends on the pipe type and the preparation process due to the narrow inner space of FED. We choose the non-evaporating alloy degasser of Zirconium-Vanadium-Fe with the activation temperature around 400℃. The insulation pole can keep the range interval between cathode and anode and release the pressure of glass. The fiberglass that we use is round 110μm with high light transmittance, high planeness, strong tensile stress, low coefficient of thermal expansion and permeability. The fiberglass that we use belongs to the soda-lime glass series originated in Japan. Basically, it can fulfill the requirement of this study.3. Phosphor powder and cathode are two major obstacles affecting the merchandising plan of FED. The phosphor materials used in FED must possess higher luminous efficiency in lower electric voltage. Besides, the materials must possess a certain conductibility to bear higher density of electric current. Additionally, the materials must possess non-toxicity and low deflating volume and the florescent layer to be prepared must be smooth. Cataphoresis is adopted to prepare the anode displays. The equipments required in this study are easy to control based on smooth coating and high resolution. The electrolyte is selected with references of dielectric constant and coefficient of viscous of the materials. The depositional phosphor powers are required to be baked at 380℃ with a certain degree of vacuum to avoid moistures in the air. The transmitting luminescence of FED possesses a certain requirement for the thickness of sedimentary deposit. The test result indicates that it is the optimal state to maintain the thickness of the power layer to be within 15-18μm. While, the actual energy of electron emitted by the cathode of FED is far less than that of the testing system. Thus, thickness of the powder layer should be thinner than that of the range in the test.
Keywords/Search Tags:Fabrication
PDF Full Text Request
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