Research On T720 Flip Assembly Test System | Posted on:2005-08-04 | Degree:Master | Type:Thesis | Country:China | Candidate:H S Wang | Full Text:PDF | GTID:2168360122487710 | Subject:Mechanical Manufacturing and Automation | Abstract/Summary: | PDF Full Text Request | In recent years, test system controlled by computer is widely used inindustrial manufacturing field. Technology on personal wirelesscommunication has been developed rapidly for years. Test system controlledby computer had played a very important role in manufacturing process. Adeep research is executed on flip test system for Motorola mobile phone. InMotorola new phone model T720 lunching stage, a flip test system controlledby computer is developed. Significant progress is made on the layout of fliptest system and test connecting device.1. T720 flip structure, working principle and test requirement is deeplyanalyzed. T720 flip test system is structured and the structure is optimized.2. Focus on test requirement of each individual function; study mechanicalstructure of T720 flip test system and brunch test system is designedaccordingly.3. Analyze all kinds of flip connector; raise alternative solution for connectingdevice of T720 flip test system. Analyze and compare all solution for finaldecision.4. Study requirement of each branch test system, structure software system.Deeply analyze other items that affect T720 flip test system for improvement.Evaluate test system via R&R tool. Base on failure feedback, define issues fortest system for failure escaping control. Finally the paper summaries all major conclusions of the research and pointout the direction for further development.
| Keywords/Search Tags: | flip, CLCD, CCD, sound level, test connector, test probe | PDF Full Text Request | Related items |
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