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The Design Of Auto-inspection System Of IC Package Quality

Posted on:2001-12-17Degree:MasterType:Thesis
Country:ChinaCandidate:L F ChenFull Text:PDF
GTID:2168360002450522Subject:Communication and Information System
Abstract/Summary:PDF Full Text Request
The speedy progress of the information industry revolution has increased thedemand for the Integrate Circuit(IC) raPidly The inspection of the IC package is animportan process of the IC quality assurance. A new ComPuter Vsion System, which isbased on the tCchnology of the Vihaal Intweni, can be aPPlied to the on-lineinspection of the IC Package quality This inspection sysbo can replace the oldstrUcturing system or the manual insPecting process. It will be of great value in itSspread and aPplicaion.This design has aPplied the technology of the Vitul Inshaent being discussedand exPlored in this dissehation. The principle and the aPPlication of the Pattem Matchand the Edge DeteCtion are pAnculary introduced. Owing to the use of the coInPuter,which keeps on uPgrading the power and increasing the cost Performance, there aresome advatages of the new Compater Vision SyStem, such as simpler smicthe, higherflexibility, better exPandability and lower cost. Based on the new technology ofComputer Vision; the development of the inspection system of the IC package qualityhas basically accomplished. The system can:satisfy the requirement of the on-lineinspection of the general IC product line. This project has made a helpful exPlorationfor the similar system that can eventually be a homemade product.
Keywords/Search Tags:Virtual Instrument, Computer Vision, Pattern Match, Edge Detection, IC Package Quality Inspection, LabVIEW dcvelopment platform
PDF Full Text Request
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