| With the rapid development of modern technology,the requirements for antenna miniaturization and high performance are gradually being improved.In this context,microstrip antenna has attracted more and more attention for its high frequency band,small physical size and ease of integration.Armed with their high dielectric constant,low dielectric loss,and the advantages of flexible design,LTCC(low temperature co-firing ceramic)materials has replaced the traditional materials,become the microstrip antenna selection emerging dielectric substrate material.The excellent properties of LTCC material can effectively improve the performance of microstrip antenna,realizing the miniaturization,and the multilayer structure is conducive to use antenna packaging technology(Ai P)at the bottom of the antenna design put sealing body,which is for high performance of high-performance rf system design.Based on LTCC technology,a novel microstrip antenna array working in Ku band is studied in this paper.Considering the high gain and wide band characteristics of the design target,the microstrip patch antenna with coupling gap feed is selected in the antenna unit,and Dupont951 material with strong flexibility and excellent performance is selected as the dielectric substrate material of the antenna.In combination with the determination of the initial size of antenna theory,the "+" glyph coupling feed aperture is proposed innovatively,which is verified by the simulation compared with the traditional H form gap to achieve higher performance,the effect of antenna parameters on the performance of main dimensions is verified,and on the basis of the modeling and simulation,the optimal value of the antenna size parameters is determined.Ultimately,the parasitic patch and reflector structure are added to achieve the performance requirements of the antenna unit.Finally,the designed antenna unit worked under |S11|<10 d B in the frequency,with oprating band of 13.99 ghz-15.63 GHz,the bandwidth of 1.64 GHz,the relative bandwidth of 11.1%,the resonance point of 14.8 GHz,and the return loss at the resonance point of-40 d B,the antenna has good directivity,and the maximum gain is 9.44 d Bi.In order to further improve the performance of the antenna,the array is formed on the basis of the antenna elements,and a parallel feed network composed of T power divider is used to feed the array,which verifies the relationships between various feed structures and array element arrangement and the performance of the array antenna.The array element spacing is determined by combining theory and simulation,and the relationship between array element number and array performance is studied by simulating 2×2 and 4×4 arrays respectively.Lastly,soft-surface structure and cascade cavity structure are added to the array to suppress surface waves,suppress negative radiation and improve antenna gain.In the final design,the gain of the array antenna is 21.78 d Bi,the operating frequency band of |S11|<10d B is 13.9GHZ-15.9GHz,the relative bandwidth is 13.4% and the bandwidth is 2GHz,which meets the requirements for the antenna performance in the design goal and it has obvious advantages of performance compared with the existing design.After that,the antenna array is combined with 3d-mcm technology,and the vertical structure integration scheme is adopted.By designing the packaging layer under the antenna,the design of the array packaging antenna is completed,and the influence of the key dimensions in the packaging layer on the performance of the packaging antenna array is verified,so the specific dimensions of the packaging layer are determined.The array encapsulated antenna has the advantages of high gain,wide band and miniaturization,hence it can be widely used in communication and other fields. |
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