| With the rapid development of solid state technology, the clock speed and integration density of very large integration (VLSI) chips and multichip modules (MCMs) have been increasing steadily. The clock rate has increased from several MHz to the GHz range. At such high frequencies, the interconnects behave like transmission lines and waveguides. As a result, the traditional lumped element models are no longer applicable, rendering an urgent need for electromagnetic modeling, analysis, design and simulation methods of high speed and wideband microelectronics.;In this dissertation, two important structures in modern microelectronic packaging, namely the fuzz button vertical interconnects and meshed ground planes, are studied by the quasi-static and full wave approaches, respectively. The newly developed wavelet theory is applied to the numerical computation of electromagnetic problems. A wavelet-based bi-orthonormal decomposition method is proposed and studied. Finally, numerical examples and real world problems are provided and solved. Laboratory measurements are conducted. The results of the examples in this dissertation are compared with previous publications and laboratory tests, and good agreement is observed. |
