| There has been a growing interest in realizing microsystems by heterogeneous integration of dissimilar materials and devices for enhanced functionality and reduced cost and size. The development of such applications are interwoven not only with the development of parallel technologies including MEMS, digital, RF, analog, sensors etc., but also with the development of integration technologies that provide scope for realizing the synergy of such integration.; This study is devoted to exploring the utilization of MEMS technologies as an integration technology for 3-D heterogeneous packaging of devices and systems fabricated using parallel fabrication processes with a goal of taking advantage of the synergy generated between the integrated components. Core technologies needed for such heterogeneous integration are developed and heterogeneous microsystems in the micro-optical domain, micro-fluidic domain and RF-MEMS domain are realized to demonstrate the usefulness of these core technologies. |
