| With the development of wireless communication technology,the millimeter-wave system has attracted more and more attention due to the potential application of high data-rate communications,high resolution radar detection and so on.Due to the dimensions of the passive component such as antenna reduce at millimeter wave,it is possible to integrate the whole millimeter-wave system in one package.Recently,significant efforts have been made to develop the performance,compress the size,increase the integration level and most importantly,lower the manufacture cost of millimeter-wave systems.In this dissertation,the martial performance at millimeter-wave frequency,the millimeter-wave integrated array antenna,phased array antenna in package and low side lobe integrated array antenna are studied.The main contributions of this dissertation are as follows:1.The studies of the electric properties of the Rogers laminate at millimeter-wave frequencies.To investigate the electric properties of the Rogers laminate at millimeter-wave frequencies,the ring resonator method is use to measure the dielectric constant and loss tangent.The measured dielectric constant is shown to be steady near 2.3,and increases along with the frequencies.Meanwhile,the simulation fitting method is also used to compare with the results of the ring resonator method,which achieves a good correlation.In addition,based on the measured parameters of the Rogers laminate,the measured results of the transmission line agree well with the simulation.2.The studies of 60 GHz differential integrated array antenna.Two high-gain,broadband 60 GHz integrated planar patch array antennas,without and with air cavity,are designed and implemented on Rogers 5880 substrate.The differential antenna structure is used to improve the signal integrity at millimetre-wave frequencies,and the antennas are co-designed with bonding wires of which the parasitic effect is compensated using a passive network.In the measurement,a differential transmission line based de-embedding structure is developed on silicon,mimicking the real chip packaging environment and providing reliable terminations for antennas.The measured fractional bandwidths(|S11|<-10 dB)are 13.8%and 26.2%respectively for the two structures without and with air cavity,including the effect of a waveguide to microstrip line(WG-to-MSL)transition and a branch-line balun.Both antennas have measured gain of about 12dBi.After de-embedding the return loss,the measured insertion loss of the bond wire compensation network(BWCN)is only 0.07dB higher than 50 ? microstrip line at 61 GHz.3.The studies of 60 GHz differential phased array antenna in package.A broadband high-gain integrated multilayer differential antenna without air cavity is proposed for the 60 GHz phased array system.By using the conventional low-cost printed circuit board(PCB)process,a 60 GHz integrated phased array antenna element and a 16-element phased array antenna prototype are implemented.To improve the antenna gain,bandwidth and efficiency,a superstrate and a float rectangular ring are designed.For the antenna element,the measured results demonstrate a peak gain of 8.9 dBi and the 10 dB return loss bandwidth of more than 12 GHz,while the simulated radiation efficiency is above 90%at 60 GHz band.For the phased array antenna,two beam-fixed(0 degree and 30 degree)array antennas are tested to verify the beam scanning performance,which achieve gains of 16.3 dBi and 13.6 dBi,respectively.4.The studies of 60 GHz single-ended phased array antenna in package.A low-cost multilayer antenna-in-package(AiP)solution,using the conventional printed-circuit-board(PCB)process,is proposed for the 60 GHz phased array system.The multilayer stack-up structure consists of three laminates and two bondply layers,with which the antenna element,vertical quasi-coaxial via transition,antenna feedline,power and low-speed interfaces are realized.An aperture coupled patch antenna with a compact fan-shaped feeding network and a vertical quasi-coaxial via transition are proposed,fabricated and measured.For the single antenna element,including the vertical quasi-coaxial via transition,the measured fractional impedance bandwidth(|S11|<-10 dB)is 20.2%,and the measured peak gain is 6.9 dBi at 62 GHz.Based on the single antenna,a 16-element antenna package is realized in the dimension of 14 mm x 14 mm x 0.925 mm.Measurements show that each antenna element achieves less than 10 dB return loss from 57.2 to 64.5 GHz,6±2 dBi gain across all four IEEE 802.15.3c channels.5.The studies of 100 GHz low side lobe integrated array antenna.A novel CPW series-feed integrated array antenna is proposed for 100 GHz noncontact vital-sign detection.The proposed antenna can utilize the ground power of the chip effectively,and it is advantageous to the connection between antenna and chip without an additional microstrip to CPW transition.The antenna and the bonding wire compensation network are co-designed,and the 10 dB return loss bandwidth is increased by 4 GHz with this method.The simulated results show that the integrated antenna achieve a fractional bandwidth(|S11|<-10 dB)of 10.5%,about 16 dBi gain at 100 GHz and a side lobe level less than-20 dB. |
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