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Research On Design Methodology Of SPIC

Posted on:2006-02-11Degree:DoctorType:Dissertation
Country:ChinaCandidate:M L ZhaoFull Text:PDF
GTID:1118360152990849Subject:Circuits and Systems
Abstract/Summary:PDF Full Text Request
Driven by development of modern VLSI (Very Large Scale Integrated circuit) and power electronics technology, the power IC (Integrated Circuit) has progressed rapidly and found wide applications. Recently, the smart power management system has attracted more attentions due to the development of SoC (System on a Chip) and Power SoC technology and it has made further progress with SPIC (smart power IC) design. Thus it is significant to study the design methodology of the smart power IC and to develop different kinds of the smart power ICs as well as the smart power IPs (Intellectual Property) demanded by market and technology progress.The main contents and innovative points of this dissertation are:By analyzing the usual design flow of the mixed signal IC, a design methodology and a top-down design flow is brought forwards, which is specially developed for Smart Power IC in accordance with its requirements such as high-low voltage compatibility, mixed signal and power integration, etc. And a design environment is built which is suitable for developing the smart power IC under the support of the BCD technology. It will be beneficial to the building of the design platform for these IC products.In power IC design, power dissipation, temperature rising and thermal effects are of key importance. They are discussed in details in this dissertation and several solutions of the thermal protection circuit have been put forwards. As an example, a high precision temperature sensing circuit is designed and tested, which has proved well linear with temperature. Besides being as a precise temperature measurement module, it can be used as a sensor product and applied to industrial fields.Finally, a typical smart power IC—Hot Swap Controller is designed by using the top-down design flow developed by author under the support of the 1.5μm BCD technology. The chip features largely in its quite complex control logic and multi protection functions. And a power MOSFET is also integrated into it.The work of this dissertation is closely combined with the development of a series of the power ICs. The design methodology and technology developed by author has been successfully applied to the chip designs. And all these can be considered as the basis of further development of Smart Power IC and power modules in different kinds of SoC as well as the design platform of Smart Power IC.
Keywords/Search Tags:Mixed-Signal System, Smart Power Management, Power IC, Design Flow, Hardware Description Language (HDL), Protection Circuits
PDF Full Text Request
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