Electromagnetic Analysis And Designs Of Vertical Interconnections In Three-Dimensional System-in-Package

With the rapid development of microelectronic technology, the traditional two-dimensional package can not cope with the growing space demand for multifuncational chips. Three-dimensional integrated circuit (3-D IC) and its system-in-package (3-D SiP) have the advantage of high space utilization. However, 3-D SiP has complicated structures, which may cause electromagnetic interference problems among inner interconnections. This research emphasizes in the investigations of high-frequency electromagnetic interference problems on vertical interconnections in 3-D SiP. The thesis mainly focus on the four innovative aspects: board package’s fast algorithm optimization and interposer’s accurate modeling of electromagnetic properties, electromagnetic shielding structure design and embedded measurement platform design, the details are outlined as follows:1) A novel imaging method is proposed to enhance the convergence speed of the analytical method for analysis of the noise distributions over the power and ground planes (PGP), which shows the better convergence than the conventional mode method. Furthermore, the imaging-mode hybrid method is developed, which demonstrates the better converngence performance at both low and high frequency bands. The parasitic parameters of transmission lines and vias are exatracted in order to model the full board package signal loop. The validations are presented with a good agreement.2) The electrical characteristics of TSVs are modeled using the analytical method based on the lumped equivalent circuit model. For further rigorous modeling, the semiconductor effects caused by the silicon substrate are introduced, including Metal-Oxide-Semiconductor (MOS) effects and Metal-Semiconductor (MS) effects. Especially, Ohmic and Schottky contacts are taken into account in th high frequency equivalent circuit models.3) A novel useful shielding and bias-to-ground scheme with MS high-doped ring contact is designed and analyzed. The multi TSV array and the shielding RDLs are proposed in the thesis. For the sake of validation, the RDL test vehicle and measurement are proposed and conducted, which directly and indirectly validates the novel shielding ideas.4) A design of TSV test vehicle based on redundant shielding passive TSV arrays is proposed, which is compatible with the current TSV process. The structure can reduce the crosstalk of TSV-RDLs significantly and the full-wave simulations show that the de-embedded method is able to achive a better solution..