Research On SiP Cross-scale Multiphysics Coupling Modeling Method Based On Substructure

With the continuous development of advanced packaging technology,electronic products are able to achieve greater performance through higher packaging density.The higher packaging density not only improves the performance of electronic products,but also makes the physics coupling effect inside the package structure more obvious.At the same time,higher packaging density means the size of package interconnect structures are smaller and the number are larger,which makes the cross-scale problem of package structures in finite element modeling more serious.Therefore,it is import to study the cross-scale multiphysics coupling modeling method of package structure to improve the efficiency and design ability of finite element analysis.This thesis takes the embedded microchannel multi-chip SiP structure as the research object,and studies the cross-scale multiphysics coupling modeling method of package structures based on the substructure method.The main research content of this thesis is as follows:(1)Research on the method of establishing the substructure model of the solder ball.Firstly,the geometry of the CBGA solder ball is simplified,and the mesh-independence of the mesh of the solder ball is verified,the meshing method of the solder ball is determined.Then,the equivalent elastic modulus of the solder ball substructure at different temperatures is determined,and the master degree of freedom surface of the solder ball substructure is determined.The generation process of the solder ball substructure is streamlined,and the code is written to realize the automatic generation of the solder ball substructure.Finally,the accuracy of the solder ball substructure model is verified by example.The results show that the calculation results obtained by the substructure method are less different from the calculation results obtained by the conventional finite element modeling method,which proves that it is feasible to use the substructure method for multiphysics coupling simulation of pakcage structures.(2)Research on heat dissipation characteristics of embedded microchannel substrate based on HTCC.Firstly,a numerical calculation model of embedded microchannel substrate is established in Icepak,and the heat dissipation characteristics of the substrate under different inlet flow rates are studied.It is found that increasing the inlet flow rate of the working fluids for cooling can effectively improve the heat dissipation ability of the microchannel.Then,the microchannel substrate liquid temperature experiment was carried out to verify the accuracy of the numerical calculation model.(3)Research on multi-field coupling simulation method of SiP structure.Under the APDL and Workbench platforms,a multiphysics coupling simulation system composed of Icepak,Static Structural,Modal,Random Vibration modules was established,and the thermal-mechanical-vibration coupling simulation analysis of embedded microchannel multi-chip SiP structure was completed by using the substructure method,and the fatigue life of SiP structure under given random vibration load was calculated.