Multiphysics Simulation And Software Development For Interconnects And Packaging Structures

With the development of integrated circuit and packaging technology,the continuous scaling of interconnects and transistors increases the power density,bringing about more reliability problems and serious thermal issues.The electrocal designs are increasingly dependent on approximate solutions obtained from mathematical models,and the computational cost for numerical analysis is also increasing.Developing numerical analsys tools is of great importance.On the one hand,the coupling effect among multiphysics in interconnects and packaged systems improve with increased integration,therefore the comprehensive analysis of multiphysics coupling problems must be performed when developing numerical analysis tools.On the other hand,in order to ensure the accuracy of the analysis results,it is necessary to build more complex mathematical models.The optimization and efficiency of simulation algorithms are also of great significance.In this dissertation,firstly,the mutual coupling relationship of multi-physics is analyzed in the electro-thermal-stress multiphysics coupling problem of integrated circuit and package system.Then the finite element method is applied to write the electro-thermalstress analysis software.After that,the multiphysics problem of typical interconnect structure is analyzed based on the software,and the accuracy of the algorithm is verified by comparison with commercial software.Besides,the finite difference method is adopted to analyze the thermal problem of package structure,and a fast algorithm: alternating direction implicit difference algorithm is introduced.On this basis,the ADI method is implemented by parallel cyclic reduction algorithm to realize the GPU parallel acceleration,and the efficiency as well as the accuracy of the algorithm are verified by comparison with commercial software.And an effcient thermal analysis software is developed based on thermal-ADI.The software developed based on the finite element method and the finite difference method in this dissertation have strong versatility,high efficiency and is easy to use,providing a convenient analysis tool for electronic designs.