Research On Key Technologies Of Tile-type Multi-beam RF Microsystem

Multi-beam phased array systems play an irreplaceable role in complex multi-target radar applications with their excellent detection performance and efficient beam configuration and data transmission.The technology of RF microsystems benefits from the advancement of So C,Si P technology and process processing in recent years,enabling more complex electronic systems.The study of low-cost,miniaturized and highly integrated tile RF microsystems is of great significance for the development of multibeam phased arrays.In thesis,two tile multi-beam systems are designed and implemented by using RF microsystem integration technology: X-band eight-beam receiving module and Ku-band eight-beam transceiver module.In thesis,an X-band eight-beam receiving component is designed using a multilayer PCB with an overall size of 80mm×80mm×21.5mm.The substrates are interconnected with pogo pins to realize solderless assembly and low-loss transmission between boards.According to the large number of cross-signal wiring requirements of multi-beam synthesis network,32 HTCC switching network modules are designed,which reduces the number of layers of multilayer PCB,thereby greatly reducing the cost of the board,and the test results show that the unit loss of stripline under the X-band HTCC process is0.1d B/mm,and the unit delay is 10ps/mm.The X-band eight-beam receiving component achieves a single-channel linear gain of 17.9d B in the operating frequency band,an output1 d B compression point of 9.8d Bm,and a single-channel noise figure better than 1.65 d B.As the frequency of the application increases,the density and difficulty of integrating multibeam components increases.In addition,an eight-beam transceiver component for32-channel antenna ports in the Ku-band is designed according to the design concept of tile type,and amplitude-phase modulation and beamforming are realized in a space of only 42mm×42mm×7.5mm.The system is implemented by stacking two HTCC substrates vertically,and the heat dissipation and electromagnetic shielding between the ceramic devices are realized by co-firing heat sink.In thesis the innovative design of the RF pin structure realizes the vertical interconnection between the low-cost boards,and the miniaturized wideband two-minute power divider is designed in the ceramic substrate.