The Research Of Key Technologies On Miniaturized T/R Module With Multi-beam

AESA(Active Electronically Scanned Array)has been widely used in military products because of its advantages such as ultra-long range detection distance,high-precision measurement capabilities,multi-target tracking and high data update rate.The number and function of T/R modules in AESA determine the importance of their production costs and performance indicators,especially for airborne,missile and satellite radar,the volume and weight of T/R modules will determine the motor performance of fighters,missiles and other defense equipment.Only high-performance,small size,light weight,low cost,high reliability T/R modules to meet the increasingly complex combat environment.From the current development trend,the key technologies to reduce the cost of T/R modules and achieve miniaturization are still with MMIC(monolithic microwave integrated circuits),MMCM(microwave multi-chip modules)technology.This paper starts from two directions,one is the design of MMIC LNA(low-noise amplifier),the other is take advantage of microwave multi-layer PCB technology to reduce the size and processing costs of T/R modules.Specific research includes:First,the structure and performance of the 64-unit T/R array are introduced in detail.The circuit structure and performance index with basic functions,technical requirements and specific technical indicators of single T/R unit are presented.Receive and transmit channels with link budget according to the electrical performance of various components are designed separately.Second,a MMIC LNA operating in the K-band is designed based on the 0.13?m GaAs PHEMT process line.In the working frequency band,the noise figure of LNA is less than 1.8d B,the gain is more than 20 dB,the input-output VSWR is less than 1.8,the reverse isolation degree greater than 30 dB,1dB compression point output power 3.7dBm.The chip size of LNA is less than 1.65mm×0.75mm×0.1mm.Third,the microwave multilayer PCB architecture is used to high-density integration of T/R module after compared the three basic types of microwave MMCM.Microwave multilayer board is introduced from material selection to processing technology.The passive circuit in the board is studied.Taking into account the importance of three-dimensional transmission of microwave signals,the vertical interconnection structure is analyzed with large place,including the effect of back drilling depth and concentricity on transmission performance and phase.What's more,the similarities and differences of transmission lines drawing at different angles from the vertical transition are elaborated.Fourth,the power synthesis/distribution network in the T/R module is extracted and processed separately.The inconsistency of the performance index of each channel is analyzed after comparing measure results with simulation results.The performance difference of single-state multilayer board power splitter cascade with 0° or 180° vertical interconnect structure is compared.