Research On Thermal Comfort Of Headphones In The View Of 3D Head And Ear Characteristics

The headphone is one of the most promising smart wearable products in the future market,and the continuous improvement of its wearing experience is a necessary guarantee for sustainable development.Wearing thermal comfort is one of the important indicators to evaluate the experience satisfaction level of headphones,which plays an important role in affecting consumers’ willingness to buy,but the current research provides insufficient design guidance.The thermal comfort of headphones is mainly affected by its component size and materials,while the research on thermal comfort of materials is universal and rich in research results.Therefore,the purpose of this thesis is to study the influence of different dimensions of the dominant thermal comfort components of headphones on wearing thermal comfort on the basis of adapting to the characteristics of Chinese head and ears.Thus,a set of headset size design scheme with great practical value is formed,which provides power for enterprises to enhance the market competitiveness of their own products.First of all,through the research on the thermal comfort of head-wearing products and the design methods of wearable products based on three-dimensional human body characteristics,this thesis constructed a research framework for the thermal comfort of headphones based on three-dimensional head and ear features.According to the research framework,this study made an in-depth study on the formation mechanism and influencing factors of thermal comfort,and analyzed the corresponding relationship among the design features,actual wearing status and head and ear characteristics of the key components of headphones.Finally,ear pads were selected as the main research object of thermal comfort of headphones.Then,based on the Chinese three-dimensional head database,the head and ear characteristics of Chinese people are extracted,measured and statistically analyzed to provide guidance and constraints for the size design of headphone ear cushions.In this study,the scale of the ear cushion is taken as the design variable,and seven prototype ear cushions are designed based on the ear measurement percentile.The 2mm of the length difference of each ear cushion increased successively(the aspect ratio and other parameters were fixed),which can adapt to more than 95%of the external auricle size of the Chinese.At the same time,questionnaire survey and expert interview were used to study the high-frequency use scene of headset,and it was found that the indoor static scene such as office scene was the high-frequency use scene of headset.Based on this,the environmental parameters of the experimental scene,the layout of the scene,the amount of activity of the subjects and other factors were controlled.Finally,through the design and implementation of the thermal comfort experiment of headphones,30 subjects tested the subjective thermal comfort of 7 prototype headphones(each worn for 1 hour).The objective measurement data of microenvironment temperature and relative humidity in the ear cushion were collected.The experimental data were interpreted through the analysis of variance of repeated measurements and the correlation analysis of subjective and objective data.The results showed that 7 kinds of ear cushions could be divided into 3 groups according to subjective evaluation(P<0.05).There was no difference in subjective evaluation of inner ear cushions among each group,and the subjective evaluation of each group increased in turn:the thermal comfort of the subjects increased with the increase of the size of ear cushions.The thermal discomfort and the temperature and humidity of microenvironment increased with the increase of wearing time,and the temperature of microenvironment was the main factor affecting the thermal comfort of the subjects(P<0.05).Based on the analysis conclusion and the interview information after the test,the reference of the dimension design of the leading thermal comfort components was put forward.Then according to the Chinese head and ear databases to supplement the dimension design of non-dominant wearing thermal comfort components to provide suggestions.Finally,a complete set of headset size design reference was formed,which was used as a guide to produce product design scheme.