Intelligent Power Package Database Management System

In recent years,China's attention to the semiconductor industry has reached an unprecedented height,chip packaging as an essential link in the semiconductor industry chain is also the most competitive link in the world at present.Through the field investigation on the packaging design of TFC microelectric chip,this topic found that the product is still in the stage of manual management in the design and development,and the unified data information management platform has not been established,resulting in low design efficiency.In view of the present situation,this paper combines the modern information means with the traditional chip package design process,so as to realize the construction of intelligent power package design database management system.The main research contents are as follows:(1)Complete system requirement analysis according to the actual business process of current chip packaging design of the company.It focuses on disassembling and analyzing the functional requirements of the system and finally confirms that the system should have two functional modules: information input and information output.In view of the situation that the same or similar type of power package appearance will be used repeatedly,the information copy function is added to meet the diversified needs of the business.(2)according to the system demand analysis,USES the My SQL relational database to store data;The system network architecture mode is B/S mode.The front-end interface is designed by React + Ant Design,and the mode of Node.js platform + Express framework is used to realize the separation of front-end and back-end.The backend uses SSM(Spring + Spring MVC + My Batis)technology framework.To realize the establishment of intelligent power package design database management system.And according to the database design principles,design the database conceptual model,and then complete the database table structure design according to the conceptual model.(3)On the basis of the system requirements analysis and design,the implementation of the information input module,the information output module and the information copy module of the system is completed by using Java programming language.Through the system interface drawing and part of the code display,and passed the relevant tests.To a certain extent,the system can improve the efficiency of chip power package design and play a positive role in improving the information management level of the company.