Experimental Study On The Performance Of Compound Liquid-cooled Device For Communication Cabinet

With the development of information technology,the scale and number of data centers have increased greatly,and the problem of energy consumption in data centers has become increasingly prominent.The data center cooling system,which accounts for 37% of the total energy consumption of the data center,is considered to be one of the key points to reduce the total energy consumption of the data center.With the increasing demand for global data processing,high-performance and high-power blade servers are widely used in data centers.The unit power density of data centers will reach 100W/cm2,while the maximum cooling capacity provided by traditional data center air cooling technology is only 37W/cm2.Combining the above two situations,seeking new cooling methods and cooling media has become an urgent problem to reduce the total energy consumption of the data center on the premise of ensuring the safe and stable.operation of IT equipment.At present,the commonly used cooling methods mainly include room level cooling,row level cooling,cabinet level cooling and server level cooling.The commonly used cooling media mainly include air cooling,liquid cooling and heat pipe cooling.Based on the existing problems of data center cooling technology and the characteristics of different cooling methods and cooling media,this paper proposes a cabinet-level compound liquid-cooled device with insulating oil as the cooling medium,and constructs an experimental test platform for the device.Among them,the compound liquid-cooled radiator is a flat fin heat exchanger added in the data cabinet on the basis of the back plate liquid-cooled radiator.Using the test platform,the heat dissipation performance of the compound liquid-cooled cooling device and the backboard liquid-cooled cooling device was investigated under different experimental conditions.And further explore the heat dissipation performance and waste heat recovery potential of the compound liquid-cooled heat device under different experimental conditions.The influencing factors of the performance of the liquid-cooled device include the initial temperature of the cooling medium,the power of the heat source,the wind speed of the fan and the circulating flow rate of the cooling medium,while the heat dissipation performance evaluation indexes include heat dissipation,cooling efficiency,the internal average temperature of the cabinet and COP,etc.In the comparison experiment of heat dissipation performance between the compound liquid-cooled device and the back-plate liquid-cooled device,the cumulative heat dissipation,cooling efficiency and average COP value of the compound liquid-cooled device under different test conditions are 42.45%,75.33% and 75.68% higher than that of the back plate liquid-cooled device,respectively.For the data cabinet with compound liquid-cooled device for heat dissipation,after 8 hours of operation,the average temperature inside the cabinet is133? lower than that of the data cabinet with backboard liquid-cooled device,and the maximum temperature is 14.1? lower.The experimental results show that the compound liquid-cooled cooling device has better heat dissipation performance than the back plate liquid-cooled cooling device.In the analysis experiment of heat dissipation performance of the compound liquid-cooled device,the average value of cumulative heat dissipation and cooling efficiency of the compound liquid-cooled device under different test conditions is 12675.1k J and18.04%,respectively.The accumulative heat dissipation range of the device is between9600.7k J and 16657.7k J,and the cooling efficiency is between 12.49%~23.67%.After 8hours of operation,the average internal temperature of the data cabinet with the compound liquid-cooled device is 59.4?,and the internal temperature of the cabinet ranges from48.9? to 69.1?.Under different experimental conditions,the average distribution temperature in the cabinet is all 70? lower than the safe operating temperature of IT equipment.The experimental results show that the compound liquid-cooled device has good heat dissipation performance and can provide a good working environment for IT equipment to ensure the safe and stable.operation of the equipment.The heat dissipation performance and energy conversion efficiency of the compound liquid-cooled device are mainly affected by the initial temperature of the cooling medium,the power of the heat source,the wind speed of the fan and the circulating flow of the cooling medium,among which the power of the heat source and the initial temperature of the cooling medium are the main influencing factors.After 8 hours of operation,the average exhaust temperature and cooling medium temperature of the data cabinet using the compound liquid-cooled device are 64.2? and59.8? respectively.The cabinet exhaust temperature ranges from 50.1? to 68.7?,while the cooling medium temperature ranges from 55.5? to 72.1?.The temperature of the above two cooling media can meet the temperature requirements of the waste heat recovery technology on the recovery medium,so the two cooling media have the potential of waste heat recovery.If the waste heat carried by this cooling medium is recovered,the annual economic benefits are 9400.2 yuan/rack and 2920.3 yuan/rack respectively.According to the first law of thermodynamics,the heat transfer process of the compound liquid-cooled radiator cabinet system is analyzed and its theoretical calculation model is established.The average relative error between the theoretical and experimental values is 10.81%.It shows that the model is representative and accurate.