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Research On Broadband High-efficiency Power Amplifier Based On Bare Die

Posted on:2022-04-12Degree:MasterType:Thesis
Country:ChinaCandidate:M T HanFull Text:PDF
GTID:2518306524985709Subject:Master of Engineering
Abstract/Summary:PDF Full Text Request
With the advent of the fifth generation of mobile communications,people's lives have become increasingly colorful.The user enjoys the convenience brought by technology through various software on the terminal,and behind it is the ever-increasing amount of transmitted data.In order to increase the transmission capacity of the communication system,the communication frequency band has been expanded to the millimeter wave frequency band.With the increase of communication frequency,the influence of transistor packaging parameters on the performance of the power amplifier is becoming greater and greater,and the influence of the bonding alloy wire on the performance of the radio frequency circuit has also become not negligible.Therefore,how to eliminate the influence of gold wire on the power amplifier matching circuit and design a broadband high-efficiency power amplifier is worth exploring for domestic scholars.In response to the appeal,this article first analyzes the working principle of continuous power amplifiers and the impact of gold wire on the performance of RF circuits.And by establishing an equivalent circuit model of the gold wire,the load impedance of the transistor is spatially converted to the bond,and then the impedance at the bond is matched with the microstrip line,and the design of the gold wire network in the power amplifier matching circuit completed.It not only solves the influence of transistor packaging parameters on the performance of the power amplifier,but also solves the influence of the gold wire on the transmission performance of the radio frequency circuit.Finally,a broadband power amplifier that works with 3-4GHz is designed.The actual test has an output power greater than 40 d Bm and a PAE greater than65%,with a gain of 13 d B.The test results verify the feasibility of the gold wire design matching circuit method.Secondly,through multiple bonding alloy wires and tests,and comparing the test results,it can be seen that the influence of the process tolerance of the gold wire on the performance of the power amplifier can be ignored.Finally,the influence of the transistor packaging parameters on the performance of the Doherty power amplifier is analyzed,and a broadband Doherty that works with3.2GHz-3.8GHz is designed through the method of applying gold wire to participate in the matching design.The actual test has a drain efficiency of 49%-61%at the saturation point and a drain efficiency of 40%-53% at the back-off point,which verifies the feasibility of the design method.
Keywords/Search Tags:Continuous working mode, wire bonding, broadband power amplifier, Doherty
PDF Full Text Request
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