Design And Implementation Of System-level Packaging For High-power IGBT Modules

IGBT is an important power semiconductor device in power electronics technology.High-speed insulated gate transistors can be used as switching tubes in DC-DC switching power supply systems.DC-DC switching power supplies are widely used in modern production and life.The packaging of insulated gate transistors and the system which uses IGBT are of great significance to the stable and reliable work of IGBT and the system.Based on the above research background,this paper studies the packaging of IGBT power modules.First,the packaging of IGBT half-bridge modules is studied.And then it researches the phase-shifted full-bridge converter based on high-speed IGBT,and system-level packaging of the converter is analysed and designed.The specific content and results of this article are:First of all,this paper studies the package design of the IGBT half-bridge module in the form of welding/binding package.Based on the analysis and research of the traditional module structure,it optimizes and analyzes the IGBT half-bridge module structure.The result of the analysis provides theoretical basis to improve the reliability of the module packaging.and then it introduces and analyzes the main packaging process of the module.Secondly,it analyzes how the phase-shifted full-bridge DC-DC converter works,focusing on some key problems,and proposes related strategies and improvement measures.It analyses the important performances of the converter including efficiency and electromagnetic compatibilityThen it puts forward the design index of the converter.And the circuit design of the converter mainly includes the main circuit and the control circuit.When designing the main circuit,the simulation software is used to verify the correctness of the simulation circuit design.When designing the control circuit,it analyzes the control theory firstly,designs the converter feedback control network based on the theory and uses Matlab to verify the correctness of the design,and finally implements this control method based on the dedicated control chip.Finally,the DC-DC converter is implemented based on the PCB substrate.Through the circuit test and waveform data analysis,the DC-DC converter realizes ZVS,works stably,and has high conversion efficiency.After verifying the correctness of the circuit,the DC-DC converter is system-level packaged.The package is designed based on LTCC technology to achieve the miniaturization of the DC-DC converter.It analyzes and designs the thermal performance and electromagnetic compatibility performance of the packaged modules.