Research On Flexible Electronic System Based On Network On Chip

The development of flexible electronics has brought a wide range of applications to wearable devices,biomedical technology,crimpable displays,and the Internet of Things.Research on flexible electronics has gradually become a hot topic.Electronic devices made of pure flexible materials are affected by their own physical characteristics,making it difficult to meet the requirements of circuit performance.The emergence of flexible electronic systems combines flexible substrates with rigid devices,and on the basis of meeting the malleable mechanical properties,it also meets the requirements for the electrical performance of flexible electronic products.The flexible electronic system adopts an island bridge structure to transfer the system-on-chip to a flexible substrate.The system-on-polymer formed can achieve a complete circuit function by a "soft-hard combination" method.With the advent of the multi-core era,more and more devices are integrated in the system-on-chip.Ensuring communication efficiency between multi-cores on the island-bridge structure is the most important issue that complex flexible electronic systems need to solve urgently.The emergence of network-on-chip technology solves the communication problem between different devices in the system-on-chip,and provides communication guarantee for multi-processor integrated systems.When the communication technology of the network-on-chip is applied to the system-on-polymer,it can realize large-scale and complex flexible electronic systems,which is of great significance to the research of flexible chips integrated with multifunctional devices.This article takes the evaluation of the network-on-chip technology instead of the system-on-chip for the system-on-polymer as the background,and aims to study the communication performance of complex flexible electronic systems.For the flexible electronic system platform based on the network-on-chip,the physical structure model,mechanical performance characteristics,and interaction electrical performance characteristics of connected wires and performance of flexible electronic systems.The main research contents and results of this article are as follows:(1)Research on structural design and mechanical properties of flexible electronic systems.A finite element model of a flexible electronic system based on the network-on-chip is established,and mechanical performance analysis and physical structure design of a flexible island bridge substrate and a flexible serpentine wire are performed according to the mechanical principles,and mechanical deformation models of flexible electronic systems with different the network-on-chip sizes are obtained.Based on the control variables that meet the uniform force of the substrate and the conductor,the stress analysis of each flexible electronic system under tensile,compression,and bending loads is performed.The simulation results show that the designed flexible network-on-chip system structure has a maximum tensile displacement of 30% and a maximum compression displacement of 20%.The deformation of the flexible electronic system causes the stress of the serpentine wire to increase.The maximum stress value of the serpentine wire on different network scale structures decreases first and then increases,and a minimum value is obtained in the 4×4 matrix structure.The model is the optimal mechanical structure of a flexible electronic system based on the network-on-chip.(2)Extraction of parasitic parameters and time domain analysis of flexible interconnected wires.The wire deformation model of the optimal mechanical structure of the flexible electronic system based on the network-on-chip is derived,and the resistance,capacitance,and inductance parameters of the serpentine wire under different substrate displacements are extracted.The influence of factors such as frequency and the displacement of the substrate on the parasitic parameters of the serpentine conductor was analyzed,and the relationship between the coupling capacitance,mutual inductance,the displacement of the substrate,and the distance between the conductors was studied.Based on the equivalent circuit delay model,a flexible interconnect delay model is established,and the variation of the delay parameters of the serpentine conductor caused by the coupling effect is analyzed in the time domain.The simulation results show that compared with the undeformed serpentine wire,the maximum displacement of the substrate tension increases the delay of the wire by 16.4%,and the maximum displacement of the substrate compression reduces the delay of the wire by 11.41%.(3)Functional verification and communication performance analysis of flexible electronic system based on the network-on-chip.According to the research on the network system structure of the chip,the routing nodes of the 4×4 Mesh structure network-on-chip are designed,the functional verification of the router and the routing network is completed,and the area and delay performance of the network-on-chip are analyzed.The delay caused by the serpentine wire is added to the flexible electronic system based on the network-on-chip,and the communication bandwidth of the link is calculated.Compared with the 4×4 Mesh structure network-on-chip communication bandwidth of the straight wire,the design of the flexible island bridge structure The communication bandwidth is reduced by 3.81%,and the deformation of the maximum displacement of the substrate reduces the communication bandwidth of the flexible electronic system by 5.46%.