Research On SiP Reliability Analysis Method In Complex Environment

The thesis mainly studies the reliability of system-in-package(SiP)devices in complex environments.By using ABAQUS finite element analysis software,a finite element simulation model of SiP devices is established.Three mechanical loads including mechanical vibration,temperature and humidity were applied to the model.The internal stress distribution of the SiP device under the effects of these three environmental loads is simulated and its reliability is analyzed.According to the reliability analysis results,the structure is optimized to achieve the purpose of improving reliability.The main research contents of this article are as follows:Reliability analysis and structural optimization design of SiP devices under mechanical random vibration load.By using ABAQUS finite element analysis software,the device finite element model is established.Modal analysis and random vibration analysis of SiP devices under random vibration loads were performed.The natural frequency and modal of the model are obtained through modal analysis.Through the random vibration analysis,the stress and strain distribution during the random vibration process is obtained.By using the stress-intensity interference theory,the reliability of the device in this process is analyzed.The chip,adhesive layer,substrate thickness and chip position are optimized,and the influence of different component sizes and different chip positions on the stress distribution of SiP devices is analyzed.In order to achieve the purpose of optimizing the structure and improving the reliability of the structure.Reliability analysis and structural optimization design of SiP devices under cyclic temperature load.The ABAQUS finite element analysis software is also used to apply a cyclic temperature load around the SiP device,and the thermal expansion of the structure under the effect of the cyclic temperature is analyzed.Obtain the stress distribution cloud diagram of the SIP device model.The stress-intensity interference theory is used to analyze the reliability of the simulation results.By optimizing the size and material properties of the model components,the effects of different influencing factors on the stress distribution of the device are analyzed.In order to achieve the purpose of optimizing the structure and improving the reliability of the structure.Reliability analysis of SiP devices under humidity environmental load.By using ABAQUS finite element analysis software,the moisture diffusion of SiP devices in a humid environment is analyzed.Obtain the moisture diffusion and stress distribution under different time such as 0h,2h,10 h,20h,50 h,100h and 168 h.The stress-intensity interference theory is used to analyze the reliability of the simulation results.