thermal expansion - Globe Thesis

Keyword [thermal expansion] Result: 1 - 20 \| Page: 1 of 2
1.	Research On Properties And Mechanism Of Substrate Materials With Low Thermal Expansion Coefficient
2.	The Structure And Properties Of Al/SiCp Composites Preparated By Pressureless Infiltration For Electronic Packaging
3.	Design And Simulation Of The Structure For On-Line Determination Of Thermal Expansion Coefficient Of Polysilicon Thin Films
4.	Study On Electronic Encapsulation Material Basied On Benzoxazine Resin
5.	Study On Diamond/Copper Composites Fabricated By Surface Metallization-Chemical Co-Deposition Method In Electronic Packaging Application
6.	Uncertainty Investigation On Measuring Thermal Expansion Coefficient Of Solid Materials By The Interferometry
7.	Properties Of β-SiC_p/Al Electronic Packaging Material Fabricated By Pressureless Infiltration
8.	A <sub> 2 </ Sub> (wo <sub> 4 </ Sub>) <sub> 3 </ Sub> Tungstate Laser Sintering, High Temperature Rapid Synthesis Of Research
9.	A Micro Thermal Expansion Fluidic Gyroscope And Its Key Technology
10.	Pressureless Infiltration Prepare For SiC/Al Electronic Packaging Materials
11.	Analysis Of Thermo-mechanical Stress In3-D Package With Through-Silicon Via
12.	Research On The Temperature Sensitivity Characteristic Of Fiber Bragg Grating In Low-temperature Condition
13.	Research On Digital Measurement And Control Technology Of Micromachined Thermal Expansion Gyroscope
14.	Semi-solid Extrusion Of Spray-deposited Al-27%Si Alloy
15.	Organization And Performance Characterization Of Low Temperature Sintered NaNo Silver Paste
16.	Development Of Capacity Test System For Thermal Expansion Valve
17.	The Study Of The Optical Fiber Grating Sensor Package Technology
18.	Study Of Frequency Stabilization And The Application In Thermai Expansion Coefficients Measurement Of Materials Of Microchip Laser Feedback Interferometer
19.	Molecular Dynamics And Lattice Dynamics Simulation Of Thermal Expansion Property Of Si Single-Crystal
20.	Properties Of SiC/epoxy Resin Composite Used For Electronic Packaging
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