| This thesis work focuses on the design, development and analysis of multi-layer organic interconnects with applications to microwave/millimeter wave packaging. The first aspect of this research involves the development and analysis of a multi-layer organic structure that can be utilized to non-destructively characterize thin film materials (<125 mum) at microwave frequencies. This research represents a breakthrough in thin film analysis at microwave frequencies for both material properties and interconnect structures for MCMs. The second aspect of this research concentrates on the analysis of multi-layer structures in a 3-D multi-chip module. Various interconnects in this 3-D packaging architecture, including embedded microstrip/stripline transmission lines, stacked vias, and connections-to-chip, are rigorously investigated to provide complete characteristics for successful designs of a multi-chip module at microwave/millimeter wave frequencies. To the best of my knowledge, the analysis and demonstration of the organic based MCM architecture and interconnects are the first results reported at W-band (75--110 GHz) for packaging applications. |
