| This thesis explores the usage of area array package designs for microwave and millimeter-wave frequency applications. Two packaging technologies, pin grid array (PGA) and ball grid array (BGA) packages, have been proposed, developed, and characterized. The PGA packaging design has been successfully developed for 32 GHz microwave modules and subsystems packaging the first time; and the BGA packaging design has been developed and characterized for millimeter-wave single chip packaging. To achieve these goals, new methodologies have been developed including an analytical de-embedding technique for accurate package measurement and characterization, as well as an a comprehensive method combining both time-domain analysis and frequency domain electromagnetic analysis. The proposed de-embedding technique overcomes the λ/4 limitations of the adapter-removal calibration method, and it has been successfully demonstrated with high accuracy from DC to 50 GHz. |
