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High-reliability BGA Reflow Soldering Process Technology Research

Posted on:2020-05-31Degree:MasterType:Thesis
Country:ChinaCandidate:S ZhangFull Text:PDF
GTID:2438330596459192Subject:Engineering
Abstract/Summary:PDF Full Text Request
BGA devices are increasingly used in military products,and the reliability of welding process of such devices often affects the reliability of the whole military products.In recent years,BGA reflow welding technology has been rapidly developed,but there is still a lot of room for improvement.BGA reflow welding has a variety of complex welding defects,which may affect the reliability of the entire military products.In view of the above problems,the project is carried out to solve the key problems.This project is mainly to solve the technical problems of bad welding effect when a military industrial unit adopts hot air infrared reflow welding for BGA reflow welding.By means of single factor,influence factor interaction test and other means,the research of BGA reflow welding process was carried out,and the optimal BGA production welding process parameters were finally found to improve the quality of BGA production welding.This topic with the aid of a variety of single factor experiment analysis,determine the influential factors of BGA reflow soldering technology namely the thickness of the PCB thickness and BGA,with the analysis of each influence factor interaction experiment method,and macro and micro technology,detection means eventually formed the eight kinds of suitable for all types of BGA device is a military unit in the production of welding process parameters.By means of mathematical statistics to analyze test data,in order to return the peak temperature and reflux time as dependent variable,the thickness of the thickness of the PCB and BGA devices and area as the independent variable,export the function relationship between the dependent and independent variables and,finally get the influence law of various key factors on the BGA welding production,convenient to the BGA welding quality control.The high reliability of BGA reflow soldering technology research of the military unit BGA welding technology research,finally formed eight BGA suitable present a military unit in the production of welding process parameters,solved a military unit air infrared BGA reflow soldering,reflow soldering,welding technology problem of adverse effect,to raise the BGA reflow welding quality and production efficiency at the same time,ensure the high reliability of BGA reflow soldering quality,improve the reliability of military products.
Keywords/Search Tags:BGA, Single-factor-test, Influence-factor-interaction-test, Metallographic analysis
PDF Full Text Request
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