The Design And Implementarion Of Hybrid IC X-Band Miniaturized T/R Component

T/R Module is the core component of phased array radar,it's performance directly determines the overall performance of the radar.With the trend of miniaturization of electronic products,in order to reduce the weight and volume of the whole radar and make it suitable for the occasions of flexible application such as ship-borne,airborne and vehicle-borne.The miniaturization of T/R module has become an important research content in the design and manufacture of radar module.This topic originates from Yaguang Electronics Co.,Ltd.It mainly studies the miniaturization of T/R module based on Microwave multi-layer board platform.X-band phased array radar is widely used in various military electronic systems because of its high frequency,short wavelength and high detection accuracy.According to the characteristics of small batch and multi variety of military products,microwave multi-layer board combines the mature technology of multilayer circuit with the characteristics of microwave materials.It is one of the best technology routes for military electronic system to use flexibly and cost effectively while ensuring low loss of high frequency signal transmission.1.Briefly introduce phased array radar,and introduce the application of T/R module in phased array radar.The application of hybrid integration technology and microwave multilayer board technology in T/R module is introduced.2.Complete the design and implementation of X-band T/R module.The principle and design of digital phase shifter and attenuator in T/R module are introduced in detail.Two kinds of chips are developed: numerical control phase shifting chip and multifunctional chip,and the key parameters of the two chips were tested in detail.The principle design of the transmitter channel and the receiver channel,the selection of components and the simulation and realization of each index are completed according to the requirements of the task book.3.Based on the multi-layer microwave board platform,the material and technology of the multi-layer microwave board are studied,and the embedding resistance technology is innovated.Processing and fabrication of T/R module,sorting out the micro-assembly process and studying the key steps,analyzing different process,guiding the final micro-assembly process of the product,the volume and weight of the finishedproduct meet the needs of miniaturization.4.Complete parameter testing of X-band T/R module,all indicators meet the project requirements.