Design And Implementation Of Planar Scotty Diode Clip Bond

Schottky diode is to use electronic components of the schottky barrier properties,is a kind of low power cons?mption,high-speed semiconductor devices,widely used in inverter,switching power supply,motor drive circuit,can be used as a fly-wheel diode,the protection diode rectifier diode,high frequency,low voltage,large current use,or in communication circuit,such as small signal detector diode,rectifier diode is used.Schottky diodes are often used for simple SMA up to 500?m,SOD123 FL,SOD323FL and other small size high-power product packaging.SOD123 FL is a new packaging form developed on the basis of SOD123.Compared with the same level of SOD123,the current capacity of SOD123 increases by more than 50%.At the same time,it is the welding mode of the whole frame structure.Because his pin is flat,compared with the design of seagull foot,it has the advantages of low thermal resistance,low junction temperature and high surge resistance.The pin can be flat on the bottom of the device,shorten the heat dissipation path,enhance the forward surge capability,improve the life of the device,and truly realize the characteristics of small size and large power.As a packaging mode of schottky diode,SOD123 FL is a welding mode in which the frame and chip are connected together by the upper and lower molds.It replaces the original Wire Bond with a new Clip Bond and completes the welding process.The author fully learning Clip Bond related process technological process and basic knowledge,understand the related chips,sintering,gages,cleaning and baking process,select the corresponding key equipment such as machine,sintering furnace,by feature selection than butt paste is suitable for the solder paste,scraping g?m by equipment capacity and user requirements to design,under the framework,and is designed to help product complete sintering graphite plate mold,and formulate the corresponding control standards and technological process,complete the initial samples.Through the visual inspection,X-ray inspection and tensile test of the samples,it was found that there were abnormal solder paste,chip tilt,frame dislocation,voidness and other waste products,but voidness exceeding the standard was the most important challenge in the early stage of sample production.Workbench18 through ANSYS software of finite element analysis was carried out on the hollow found internal chip junction temperature on the analysis of small diameter hole to chip cooling effect is not obvious,but once the empty area is too large,will cause the chip junction temperature j?mp,disable chips,and a hole near the center of the chip to chip cooling capacity is bigger,the influence of so restricting the size of the hole is particularly important.Through an in-depth study on the mechanism of hole production,it was found that the most important cause of hole production was incomplete flux volatilization.After improving the operation process,optimizing the die for the platform and increasing the cleaning of the frame,the hole was finally controlled within the scope of process control,and the mass production was successfully realized.