Reliability Research On Technology-Service Process Of Flip Chip Package Components

Flip chip devices packaged with ceramic materials are widely used in highly reliable electronic products such as aviation and aerospace industry because of their excellent thermal and electrical properties,good moisture resistance,high long-term reliability,etc.With the increase of pin number,pin density,operating frequency and power consumption,packaging technology has been continuously improved,and new materials,new structures,and new technologies have been continuously introduced Its reliability problem in harsh environment is also increasingly serious.Therefore,it is of great significance and application value to study the service reliability of flip chip devices and their package components in assembly process and harsh environment.In this thesis,the finite element model of flip chip bonding device with corresponding sample is established.The process of device assembly is simulated by using the life-death element technology.The service life of the device under temperature cycle is predicted by using the full model-submodel technology.It is found that copper pillar bumps are most likely to fail under temperature cycle,and the whole life of the device is restricted by the "short plate effect".The electromigration accelerated life experiment was carried out to obtain the electromigration life of copper pillar bumps of the sample under different ambient temperatures and current densities.The physical field distribution in the bumps was simulated by finite element simulation.The combination of the two modified electromigration Black equation of copper stud bumps of the corresponding sample.The finite element simulation model of the sample device is established and random vibration simulation is carried out.The random vibration experiment is carried out to obtain the first-order frequency of the sample.Compared with the simulation results,the error of the first-order frequency is 0.7%,and the error of acceleration response is less than 2%.The practicability of the finite element simulation model is verified.The response of flip chip in system-level package under vibration shock is explored by the same method Above simulation process was solidified by parametric method,and participated in the development of finite element simulation software considering the process assembly process for typical flip chip bonding devices.At present,the software can perform reliability simulation and life prediction under the service conditions of temperature cycle and vibration impact.The temperature of the process assembly process was optimized by using the orthogonal optimization function of the software Based on the analysis of experimental and simulation results,some possible suggestions are put forward to improve the reliability of relevant packaged devices.