Research On Heat Transfer Enhancement Of Electronic Devices Based On Combination Structure Of Dual Synthetic Jets And Fins

With the progress of social science and technology,the volume of electronic devices is getting smaller and smaller,with the increase of thermal power per unit volume of electronic devices,resulting in the increase of heat and temperature.However,the higher the temperature,the lower the working efficiency of electronic devices,and even shorten their working life,so it is very important to find a suitable cooling technology for electronic devices to cool down.Because of its advantages of high heat dissipation efficiency and high reliability,synthetic jet technology has been applied more and more in the enhanced heat transfer of electronic devices in recent years.Fin heat dissipation is one of the most common passive heat dissipation technologies.The rectangular perforated fin is a kind of fin formed by processing and punching the rectangular fin on the basis of the rectangular fin.Due to its efficient heat transfer performance and material saving characteristics,it has been widely used in the heat dissipation of electronic devices in recent years Moreover,the combination of active and passive composite with dual synthetic jets finned fins is of high efficiency in heat dissipation.In this paper,a series of relevant researches are carried out by means of numerical simulation and experiment.The specific work is as follows:Based on the theories of heat transfer and computational fluid mechanics,Through numerical simulation of heat dissipation,the influence of various structural factors on heat transfer performance of fins was studied.Using fins to heat the heated substrate,it was concluded that when the length,width and height of fins were 60mm×4mm×30mm,the number of perforations was 6,and the spacing between fins was 8mm,the heat transfer performance was the best.Through numerical simulation,the flow field and heat dissipation characteristics of the dual jets are synthesized under each working condition.It is concluded that when the frequency is 650 HZ and the amplitude is 0.22 mm,the peak velocity of the external flow field of the exciter reaches the maximum.Using jets to heat the heated substrate,when the impingement distance of the excitations is 30mm and the driving frequency is 550 HZ,the efflux heat dissipation performance is the best.At this time,the average temperature of the substrate is only 43.5?,which is 16.01? lower than that of the optimal fin heat dis sipation alone.The convective heat transfer coefficient is nearly 6 times higher than that of the fin heat dissipation alone.At last,the heat dissipation experiment of the active and passive combination was carried out.The experiment shows that under the heat dissipation effect of the optimal combination,the average temperature of the heating substrate is only 32.4?,and the heat dissipation effect is obvious,which has great engineering application value.