The Research Of High Heat Flow Device Heat Dissipation Measures In Vacuum

Due to its high heat, the reliability of high heat flux devices becomes and moreprominent. Compare to the atmosphere environment, the operating temperature risewill increase sharply in vacuum environment, because the heat dissipation power ofdevice only be removed through heat conduction and heat radiation cooling.Therefore, it is particularly important to perform the thermal analysis of high heat fluxdevice in a vacuum environment.In this paper, analysis of various thermal management schemes is studied,including PCB, thermal interface material and heat sinks, based on the practice ofengineering. All these data provides reference data for thermal design of high heatflux devices. This paper has mainly carried on the following three aspects:Firstly, PCB which carries the electronic components in circuit system hascertain effect on the heat dissipation, especially in the vacuum environment. As thesystem volume decreases and the increase of the electronic component integrationlead to its temperature rising sharply. Therefore, in order to improve the thermalperformance of PCB, thermal characteristics of PCB in different coverage Cu,different thermal via diameter, different thermal via pitch, different number of thermalvia is studied.Thus, we obtain the thermal resistance of PCB in the atmosphere andvacuum environment. All these date we obtained provide references for the PCBthermal design.Secondly, the thermal characteristics of thermal interface materials in vacuumenvironment are studied. We obtain the relationship between the operatingtemperature and the applied pressure. Meanwhile, the mechanism of how differentthermal interface materials affect on the interface thermal resistance is analyzed invacuum environment. Thermal interface materials can reduce the interface thermalresistance in vacuum environment, so it can be used to improve the heat conduction ofinterface. Therefore, it has played a positive role in heat transfer of high heat fluxdevice. The date we obtained provides reference for their application in practicalengineering.Thirdly, based on genetic algorithms the volume of radiator volume is optimized,while it can meet the cooling needs. Then the temperature of radiator is simulated by Icepak software. Meanwhile, through analysis the thermal characteristics of radiatorin different surface areas in the atmospheric and vacuum environment, we obtain therelationship between the thermal resistance and surface area. Than we study thecooling effect of thermal radiation in vacuum through experiment. The results showthat it is can effectively improve the heat transfer of radiator with improving itsradiate ability. These data provide reference evidence for the production andapplication of the radiator.