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Design And Research Of The SIW-based Filter-Antenna In Package Based On LTCC Technology

Posted on:2020-08-20Degree:MasterType:Thesis
Country:ChinaCandidate:D D KuangFull Text:PDF
GTID:2428330602950768Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
The maturity and improvement of wireless communication technology,constantly driving the development of wireless communication equipment towards miniaturization,multifunction and low cost.Antenna-in-Package(Ai P)integrates the antennas and the IC chips into a whole,and uses the Three-Dimensional Multi-chip Module(3D-MCM)technology to stack and interconnect the multi-chip components in the vertical direction,effectively implementing the small size of the RF system.Meanwhile,Low Temperature Co-fired Ceramics(LTCC)support the miniaturization and cost reduction of electronic devices due to their high dielectric constant and excellent process.Therefore,in order to cater to the development direction of wireless communication equipment,this article has carried on the design and research of the SIW-based filter-antenna array in package based on LTCC technology.Firstly,two-order and fourth-order filters based on SIW structure are designed in combination with filter theory.The two-stage filter-antenna is designed by replacing the last resonant unit of the two-order filter with a patch antenna.A new type of filter-antenna is proposed by replacing two resonant units of the fourth-order filter with two patch antennas.The designed filter-antennas have good filtering performance and radiation performance.After that,filter-antenna arrays are designed based on two kinds of filter-antennas,which have retained the filtering performance of a single filter-antenna and achieved higher gain.Then,a package cavity is designed for integrating IC chips.In order to shield the external electromagnetic field,the cavity is surrounded by two metal layers and metallized vias.Finally,the filter-antenna arrays and the package cavity are integrated as a whole in the form of a vertical package.The influence of the key parameters of the final Ai P system on its performance is analyzed.The designed antenna-in-package has good directivity,high gain,high radiation efficiency and stable performance,can be applied to Ka-band wireless communication applications.
Keywords/Search Tags:AiP, LTCC, 3D-MCM, SIW, filter-antenna
PDF Full Text Request
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