The Design And Implementation Of Electronic Component Reliability Analysis System For A Research Institute

Electronic components are used in all areas of daily life.By analyzing the reliability of electronic components,the quality of electronic components can be guaranteed and the performance of electronic products can be improved.At present,there are some problems in the field of reliability analysis of electronic components The researchers lack the information-based means to calculate the reliability index of electronic components,and the degree of refinement of indicators is insufficient.It is difficult for the staff to quickly locate the failed modules and parts of the electronic components,which affects the packaging reliability of the electronic components.In order to solve the problems existing in the reliability analysis of electronic components,the design and implementation of the system is carried out.In the process of developing an electronic component reliability analysis system,the technologies applied include B/S architecture,Spring MVC framework,and Oracle database.The B/S architecture stipulates the form of browser access server,which combines Ajax technology to optimize server resource allocation and exploit the potential of server components.The Mybatis framework provides a variety of interfaces and components for data access and processing that ensure efficient data retrieval processing.Spring MVC framework technology provides a flexible model transformation mechanism.It enhances the effect of front-end display based on the integration of MVC modules.The Oracle database is responsible for system data management tasks to ensure the security of system dataComponent library management,material library management,interconnected structure library management,thermal limit management,and mechanical anti-harmonic management are modules of the electronic component reliability analysis system.The functions of the library management module include thermal component management and mechanical component management.The functions of the material library management module include thermal material management and mechanical material management.The functions of the interconnected structure library management module include thermal interconnect structure management and material interconnection structure management.The thermal limit management module functions include thermal component management,thermal limit analysis,thermal optimization design,thermal component design parameter input,and thermal output.The functions of the mechanical anti-harmonic management module include anti-harmonic component management,anti-harmonic optimization design,anti-harmonic report management,and anti-harmonic component design parameter input.The application of this system provides an advanced means for the research staff to analyze the reliability of electronic components.Workers can quickly locate modules with reliability issues in electronic components to ensure the quality of electronic components.In addition,staff can use information technology to calculate key indicators of electronic components,which ensures the fineness and accuracy of the reliability analysis system.