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Analysis Of Waveguide Structures And Transmission Characteristics In High-Speed Interconnects

Posted on:2019-03-16Degree:MasterType:Thesis
Country:ChinaCandidate:X T WangFull Text:PDF
GTID:2428330590967407Subject:Electronic Science and Technology
Abstract/Summary:PDF Full Text Request
With the development of integrated circuits,the rate of chip processing and data transmission increasing,and the supply voltage of the system gradually decreasing,interconnects has requirements on better transmission performance,such as lower loss and higher bandwidth.In addition,simultaneous switching noise brought by low voltage levels and steep signal edges will influence transmission of the signal and cannot be ignored.Therefore,design of waveguide structures and analysis of their transmission characteristics in high-speed interconnected systems are very important.The main work of this thesis includes two aspects:Substrate integrated coaxial lines(SICL)is analyzed.First,the structure of SICL is introduced,and the propagation characteristics of SICL are described in detail,including the characteristic impedance,transmission mode and attenuation.Then,the differences between the SICL and the shield strip line with the same structure in the characteristic impedance and the electromagnetic field distribution are compared.In order to solve the problem that the baseband signal is susceptible to simultaneous switching noise(SSN),this thesis proposes an EBG microstrip line interconnect and its design method.The interconnect structure composes of the periodic arrangement of cascaded wide and narrow signal lines.The EBG microstrip line interconnect is processed by PCB technology,and the S parameters,eye diagram and bit error rate of the interconnect are tested.Good agreement between simulation results and measurement results shows that the EBG microstrip line interconnect has good pass-band transmission characteristics and stop-band rejection characteristics.Eye diagrams and bit error rate tests demonstrate that the EBG microstrip line interconnect guarantees signal integrity.Besides,the microstrip line with EBG structure etched on the signal line and the microstrip line with EBG etched on the ground plane are compared and the simulation results show that the interconnect proposed has a stronger ability to suppress SSN and better signal integrity.Finally,this thesis also studies the influence of the EBG structure on the crosstalk problems,results show that the EBG structure can be applied to the suppression of crosstalk noise.
Keywords/Search Tags:substrate integrated coaxial line, electromagnetic band gap, simultaneous switching noise, microstrip line, interconnect
PDF Full Text Request
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