Development And Research Of Cleaning Machine For Ceramic Plate

The increasing market demand for semiconductor silicon wafers brings unprecedented opportunities and great challenges to the silicon wafer processing industry.The standard diameter and surface precision of polished silicon wafer are increasing,which makes it more difficult to process silicon wafer.It is urgent to update the existing silicon wafer processing equipment and develop high productivity automation equipment that is suitable for polishing large diameter silicon wafer with higher machining accuracy.As one of the important steps of semiconductor silicon wafer processing,the Sticky Wax Polishing process of Chemical Mechanical Polishing(CMP)technology,its automation degree also needs to be improved.Due to the late start of Sticky Wax Polishing process automation equipment research and development in China,coupled with foreign technology blockade,most of the automation equipment used in the current production of enterprises is low-end equipment imported from abroad.This seriously hinders the production quality and efficiency of polished silicon wafer in China and affects the development of the industry.At the same time,domestic and foreign automatic equipment manufacturers pay little attention to the cleaning process of ceramic plate in the process of Sticky Wax Polishing,which also leads to the degree of automation of the cleaning process of ceramic plate is much lower than other steps.Therefore,in this paper,a new automatic cleaning process is put forward for the ceramic plate cleaning process in the process of Sticky Wax Polishing combined with the traditional ceramic plate cleaning process,and a fully automatic ceramic plate cleaning machine is developed.The development of this equipment improve the efficiency of ceramic plate cleaning,effectively ensure the cleanliness of the plate surface,greatly improve the degree of automation of the whole wax polishing process,accelerate the localization of the silicon wafer polishing industry automation equipment.According to the established automatic cleaning process,combined with the requirements of the enterprise,the 3D modeling software CATIA was used to design the structure of the ceramic plate cleaning machine.Including the whole machine frame,ceramic plate handing push car,feeding system,turnover system,cleaning system,turnover and unloading system,handling system.The core standard parts used in structural design,such as linear guide rail,ball screw,servo motor and cylinder,are selected and checked.And the various types of sensors,ultrasonic system and circulation pump parts are selected too.Then the manufacturers and models of various parts and components have been determined.By using the finite element analysis technology and relying on the analysis software ANSYS,the static analysis of the important bearing parts of the cleaning machine is carried out,which verifies the reliability and stability of the bearing structure.The dynamic modal analysis of the whole frame of the cleaning machine is also carried out.The design of the control system of the ceramic plate cleaning machine is carried out.According to the result of hardware selection,the hardware structure of the control system is constructed.In addition,the main circuit,control circuit and gas circuit of the control system are designed.