Research On Multi-physical Effects And High Performance Simulation Method For Advanced Integrated Packaging

Nowadays,advanced integrated packaging technology is more and more used in military defense,communications,civil and other fields,especially in the application of miniaturized equipment.However,due to the miniaturization and high chip density of advanced integrated packaging,the reliability problem of package is also very complex.The multi-physical response caused by the self-heat effect and pulse injection in the package may lead to the performance degradation and even failure of the device.Moreover,the structure of integrated packaging is generally very complex.The conventional simulation method is difficult to solve such a large-scale problem,which requires high performance simulation method to solve the large-scale multi-physics problem in advanced integrated packaging.This thesis will study the electrical,thermal,force and their coupling processes in advanced integrated packaging.Combined with the finite element method in time-domain,we will focus on the multi-physics coupled parallel simulation method based on time domain finite element method(TD-FEM)and apply it to the multi-physics effect analysis of typical integrated packaging.In this thesis,based on the equation of electric field,temperature field and stress field,the finite element solution algorithm for the multi physical coupling process of electric thermal force is studied by using the finite element method in time domain.The parallel framework JAUMIN is used to realize the parallel finite element solution of multi-physical coupling,and the parallel program is verified by commercial software.Parallel programs support parallel computing on thousands of CPU core platforms for the problem with tens of millions of even hundreds of millions of unknown quantities.Our parallel program can reach a strong scalability efficiency of 30.9%and speed up of 4.945 for electro-thermal-stress simulation on 1024 CPU cores.Then the parallel simulation program is used to study the multi-physical response of the large-scale bonding wire arrays in the power RF chip and the system-in-package.The mechanism of the reliability degradation is analyzed,and this maybe provide idea of optimizing the package structure.