Design On Millimeter-Wave Antenna-in-Package Array With LTCC Technology

With the rapid development of modern wireless communication,the existing spectrum size is limited in available allocated bands.Due to the short wavelength and ultra-wide bandwidths,Millimeter-wave bands are becoming increasingly important.As an important component of RF front-end circuit,Antenna features low profile and high performance by using Low Temperature Co-fired Ceramic(LTCC),which has high dielectric constant and low dielectric loss.With the technology of Antenna-in-Package(AiP)and Three-Dimensional Multi-Chip Module(3D-MCM),it can achieve three-dimensional interconnection by integrating antennas,RF front-end chips and package cavity into a whole framework.So the high integration of RF system can be realized.This article has carried on the design and research of Millimeter-wave Antenna-in-Package array with LTCC technology.Firstly,a circular horn antenna with high radiation efficiency based on LTCC multi-layer structure is designed.The designed antenna is fed with different slot structures to obtain optimum performance.An antenna array is designed,which is composed of horn antenna element and a feeding networks based on multiple power dividing of a stripline.Secondly,with microstrip antenna theory,parasitic patch is used to improved antenna gain.The antenna array employs parasitic microstrip antenna element with soft-surface structure,which suppresses the surface wave and further improves the gain of the antenna array.Finally,due to its low profile,the parasitic microstrip array antenna is adopted to integrate with package cavity.The three-dimensional electromagnetic simulation software HFSS has been used for modeling and simulating the designed AiP.The simulated result indicates that the antenna array features good performance with overall size of 32×29×2.268mm~3.The reflection coefficient is less than-10dB at 29.8-31.3GHz,and the simulated gain is 19.8dBi at center working frequency of31GHz with both 16°half power beamwidth on the E-plane and H-plane.The proposed AiP array has the advantages of high radiation efficiency,miniaturization,high gain and narrow beamwidth.It can be applied to wireless applications such as satellite,radar and sensor.